IMMS - Search

Reference

561. Perforated plates of inertial sensors – modeling by effective material properties

Steffen Michael, Astrid Frank G. Hölzer G. Lorenz EUROSENSORS 2014, the 28th European Conference on Solid-State Transducers, in Procedia Engineering, Volume 87, 2014, Pages 480 – 483, http://www.sciencedirect.com, DOI: http://dx.doi.org/10.1016/j.proeng.2014.11.400

Reference

562. Patents

Photograph: Matt Ridley, Unsplash / editing: IMMS.

Patents Here you will find disclosed patent applications and granted patents for which IMMS is the owner or co-owner.

Reference

563. Passive 350 GHz Video Imaging Systems for Security Apllications

E. Heinz, T. May D. Born G. Zieger S. Anders V. Zakosarenko H.-G. Meyer C. Schäffel Journal of Infrared, Millimeter and Terahertz Waves manuscript No., DOI: http://dx.doi.org/10.1007/s10762-015-0170-8, Online ISSN: 1866-6906, Print ISSN: 1866-6892, Volume 36, Number 7, July 2015

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564. Partners

Many partners from R&D projects also use our services and some we involve as innovative, certified manufacturing partners to cover the value chain up to series production. Photo (reticle for semiconductor manufacturing): X-FAB.

Partners: We involve innovative, certified manufacturing partners to cover the value chain in R&D projects. You will also find an overview of our project partners from science and industry and information on how you can become a partner.

Reference

565. Parasitic Symmetry at a Glance: Uncovering Mixed-Signal Layout Constraints

Georg Gläser, Benjamin Saft Ralf Sommer FAC 2017, Frontiers in Analog CAD, Frankfurt on the Main, Germany, 21-22 July 2017, pp. 1-6. URL: http://ieeexplore.ieee.org/document/8011279/

Reference

566. Parametric Measurement Unit und Pinelektronik für ein modulares Mixed Signal Testsystem

A. Rolapp, R. Paris 21. Workshop 'Testmethoden und Zuverlässigkeit von Schaltungen und Systemen' (TuZ 2009), Tagungsband S. 86, 15. - 17. Februar 2009, Bremen

Reference

567. Parametric Measurement Unit and Pin Electronics for modular Mixed Signal Test Systems

A. Rolapp, R. Paris Chip, Packaging, Design, Simulation and Test - International Conference, Workshop and Table-top Exhibition 'Semiconductor Conference Dresden 2009' (SCD 2009), 29. - 30. April 2009, Dresden

Reference

568. Parameteridentifikation von MEMS auf Wafer-Level mittels dynamischer Messungen

S. Michael, R. Paris S. Hering 6. ITG/GI/GMM-Workshop Multi-Nature Systems: Entwicklung von Systemen mit elektronischen und nichtelektronischen Komponenten, Februar 2007, Erfurt

Reference

569. Parameter Identification of Piezoelectric AlGaN/GaN Beam Resonators by Dynamic Measurements

St. Michael, K. Brueckner F. Niebelschuetz K. Tonisch C. Schäffel 10th EuroSimE 2009, 26.-28. April, Delft, Netherlands

Reference

570. Parameter Identification of MEMS Membrane and Beam Structures by Modal Analysis and Dynamic Measurements

St. Michael, ANSYS Conference & 27. CADFEM Users' Meeting, 18. - 20. November 2009, Leipzig