IMMS - Search

Reference

471. Performance of SpaceTime Processing for ISI- and CCI-Suppression in Industrial Scenarios

U. Trautwein, D. Hampicke G. Sommerkorn R.S. Thomä IEEE Annual Vehicular Technology Conference 2000, 15.-18.5.2000, Tokyo, Japan

Reference

472. Performance of SpaceTime Processing for ISI- and CCI-Suppression in Industrial Scenarios

U. Trautwein, D. Hampicke G. Sommerkorn R.S. Thomä In: Proc. 51st IEEE Vehicular Technology Conference, Band 3, S. 1894-1898. VTC 2000-Springer Tokyo, 15.-18.5.2000

Reference

473. Perforated plates of inertial sensors – modeling by effective material properties

Steffen Michael, Astrid Frank G. Hölzer G. Lorenz EUROSENSORS 2014, the 28th European Conference on Solid-State Transducers, in Procedia Engineering, Volume 87, 2014, Pages 480 – 483, http://www.sciencedirect.com, DOI: http://dx.doi.org/10.1016/j.proeng.2014.11.400

Reference

474. Patents

Patents: Here you will find disclosed patent applications and granted patents for which IMMS is first patent assignee or co-holder.

Reference

475. Passive 350 GHz Video Imaging Systems for Security Apllications

E. Heinz, T. May D. Born G. Zieger S. Anders V. Zakosarenko H.-G. Meyer C. Schäffel Journal of Infrared, Millimeter and Terahertz Waves manuscript No., DOI: http://dx.doi.org/10.1007/s10762-015-0170-8, Online ISSN: 1866-6906, Print ISSN: 1866-6892, Volume 36, Number 7, July 2015

About us

476. Partners

Many partners from R&D projects also use our services and some we involve as innovative, certified manufacturing partners to cover the value chain up to series production. Photo (reticle for semiconductor manufacturing): X-FAB.

Partners: We involve innovative, certified manufacturing partners to cover the value chain in R&D projects. You will also find an overview of our project partners from science and industry and information on how you can become a partner.

Reference

477. Parasitic Symmetry at a Glance: Uncovering Mixed-Signal Layout Constraints

Georg Gläser, Benjamin Saft Ralf Sommer FAC 2017, Frontiers in Analog CAD, Frankfurt on the Main, Germany, 21-22 July 2017, pp. 1-6. URL: http://ieeexplore.ieee.org/document/8011279/

Reference

478. Parametric Measurement Unit und Pinelektronik für ein modulares Mixed Signal Testsystem

A. Rolapp, R. Paris 21. Workshop 'Testmethoden und Zuverlässigkeit von Schaltungen und Systemen' (TuZ 2009), Tagungsband S. 86, 15. - 17. Februar 2009, Bremen

Reference

479. Parametric Measurement Unit and Pin Electronics for modular Mixed Signal Test Systems

A. Rolapp, R. Paris Chip, Packaging, Design, Simulation and Test - International Conference, Workshop and Table-top Exhibition 'Semiconductor Conference Dresden 2009' (SCD 2009), 29. - 30. April 2009, Dresden

Reference

480. Parameteridentifikation von MEMS auf Wafer-Level mittels dynamischer Messungen

S. Michael, R. Paris S. Hering 6. ITG/GI/GMM-Workshop Multi-Nature Systems: Entwicklung von Systemen mit elektronischen und nichtelektronischen Komponenten, Februar 2007, Erfurt