A. Rolapp,
R. Paris
Chip, Packaging, Design, Simulation and Test - International Conference, Workshop and Table-top Exhibition 'Semiconductor Conference Dresden 2009' (SCD 2009), 29. - 30. April 2009, Dresden
I. Gryl,
V. Schulze
Chip, Packaging, Design, Simulation and Test ? International Conference, Workshop and Table-top Exhibition 'Semiconductor Conference Dresden 2009' (SCD 2009), 29. - 30. April 2009, Dresden