M. Meister,
M. Reinhard
U. Liebold
D. Kirsten
D. Nürnbergk
9th International Multi-Conference on Systems, Signals and Devices (SSD), 2012, Digital Object Identifier: 10.1109/SSD.2012.6197902, http://ieeexplore.ieee.org, IEEE Xplore Digital Library, E-ISBN 978-1-4673-1589-0
“We appreciate both the technical expertise of IMMS and the high level of their commitment to our joint projects. The proactive and agile way of working of the IMMS colleagues is an essential building block for our joint success.”
”Their experience in digital IC design, synthesis, place and route, verification and sign-off using the state-of-the art tools and methods makes IMMS a great partner to work with when developing mixed-signal integrated sensors.”
“We have worked together with IMMS to develop for a Tier 1 automotive manufacturer who is one of our most imporant customers a completely new feature which will be integrated into a new sensor ASIC. When the complete system on chip was evaluated, the IP was confirmed to be operating perfectly.”
