“The systematic methods of IMMS in simulating the logic and steadily verifying all functions greatly contributed to the fact that we had an error-free chip in the very first iteration. It has been integrated into our mass-produced products since late 2016 and we are more than satisfied.”
Adrian Pitterling, Manuel Jirsak, Eric Schäfer, Georg Gläser,
Dresden, Germany
2026
2026 22th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)
Ingo Ortlepp, Michael Kühnel, Martin Hofmann, Laura Weidenfeller, Johannes Kirchner, Shraddha Supreeti, Rostyslav Mastylo, Thomas Michels, Thomas Fröhlich, Denis Dontsov, Christoph Schäffel, Eberhard Manske,
2020
Proc. SPIE 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS