“The systematic methods of IMMS in simulating the logic and steadily verifying all functions greatly contributed to the fact that we had an error-free chip in the very first iteration. It has been integrated into our mass-produced products since late 2016 and we are more than satisfied.”
Adrian Pitterling,
Manuel Jirsak
Eric Schäfer
Georg Gläser
2026 22th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), June 29 - July 2, 2026, Dresden, Germany
Ingo Ortlepp,
Michael Kühnel, Martin Hofmann, Laura Weidenfeller
Johannes Kirchner, Shraddha Supreeti
Rostyslav Mastylo, Mathias Holz
Thomas Michels, Roland Füßl
Ivo W. Rangelow, Thomas Fröhlich
Denis Dontsov
Christoph Schäffel
Eberhard Manske
Proc. SPIE 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020, 113240A (23 March 2020), DOI: https://doi.org/10.1117/12.2551044