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Press release

1401. Arbeiten an optimierten Antriebssystemen für autonome mobile Roboter begonnen

The project team of eight people is behind three autonomous robots.

Projekt ERA-AMR von MetraLabs und IMMS gestartet

Reference

1402. Applying OPC-UA for Factory-Wide Industrial Assistance Systems

Björn Barig, Kaja Balzereit Tino Hutschenreuther 2019 15th IEEE International Workshop on Factory Communication Systems (WFCS), 27 - 29 May 2019, Sundsvall, Sweden, 2019, pp. 1-4. DOI: https://doi.org/10.1109/WFCS.2019.8757868

Reference

1403. Applying Event-Based Sending Intervals to Enable Low Energy OPC-UA on Sensor Nodes

Jurgen Troci, Silvia Krug Tino Hutschenreuther 2019 27th Telecommunication Forum (TELFOR), 26 - 27 November 2019, Belgrade, Serbia, pp. 1-4. DOI: https://doi.org/10.1109/TELFOR48224.2019.8971257

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1404. Applikationsspezifischer Entwurf mechatronischer Direktantriebe

Dr. F. Spiller, ELMUG-Technologiekonferenz 'elmug4future', 23.06.2010, Suhl

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1405. Application of Wireless Sensors Within a Traffic Monitoring System

Hannes Toepfer, Elena Chervakova Marco Götze Tino Hutschenreuther Bojana Nikolić Bojan Dimitrijević International 23rd Telecommunications Forum, TELFOR 2015, 24 - 26 Nov. 2015, Pages 236 - 241, invited paper, ISBN: 978-1-5090-0055-5, Serbia, Belgrade

Reference

1406. Application of Symbolic Circuit Analysis for Failure Detection and Optimization of Industrial Integrated Circuits

Ralf Sommer, Dominik Krauße Eric Schäfer Eckard Hennig in Design of Analog Circuits through Symbolic Analysis, M. Fakhfakh, E. Tlelo-Cuautle, and F. V. Fernández, Eds., Bentham Science Publishers, 2012, ch. 17, Pages 445-477, http://www.eurekaselect.com/101990/volume/1

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1407. Application of Symbolic Analysis in Industrial Circuit Design

R. Sommer, geladener Vortrag auf der FDL'06, Forum on Specification and Design Languages, 9/2006

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1408. Application of a Modular Test System for Mixed Signal Tests

I. Gryl, V. Schulze Chip, Packaging, Design, Simulation and Test ? International Conference, Workshop and Table-top Exhibition 'Semiconductor Conference Dresden 2009' (SCD 2009), 29. - 30. April 2009, Dresden

Reference

1409. Application of 3-D EM-Simulation in Research of Integrated Inductors, System in Package (SiP) Design and Package Effects

W. Wu, M. Isikhan 11. ITG/GMM-Fachtagung ANALOG 2010, 22.03.-24.03.2010, Erfurt

Reference

1410. Application of 3-D EM Simulation in Research of Integrated Inductors, System in Package (SiP) Design and Package Effects

W. Wu, M. Isikhan 11. ITG/GMM-Fachtagung ANALOG 2010, 22.03.-24.03.2010, Erfurt, in Proceedings