2138 results
Reference
  1071. Hybrid scheme to enable DTN routing protocols to efficiently exploit stable MANET contacts  
Silvia Krug, Matthias Aumüller Jochen Seitz EURASIP Journal on Wireless Communications and Networking, Volume 2018, Article number: 237 (2018), https://doi.org/10.1186/s13638-018-1248-5  
Reference
  1072. HW/SW-Co-Entwurf einer intelligenten Sensor-Schnittstelle mit Hilfe eines schnellen, Zyklenzahl-genauen, RTL-nahen Befehlssatz-Simulators  
Gregor Nitsche, Eckhard Hennig Georg Gläser 15. Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV), 2012, Kaiserslautern, 05.03.2012-07.03.2012  
Reference
  1073. HTS SFQ circuit design  
H.Töpfer, Hitachi Central Research Laboratory, 14.11.2002, Tokyo, Japan  
Reference
  1074. HTS Multilayer Technology for Optimal Bit-Error Rate RSFQ Cells  
D. Cassel, Th.Ortlepp K.S.Ilin G.Pickartz B.Kuhlmann R.Dittmann H. Töpfer IEEE Trans. Appl. Supercond., 13(2003) 2, S. 409-412  
Reference
  1075. HoTSens  
Integrated sensors and microelectronics operate at 300°C, enabling more efficient processes  
Reference
  1076. Hot Fuzz: Assisting verification by fuzz testing microelectronic hardware  
Henning Siemen, Jonas Lienke Georg Gläser 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Funchal, Portugal, July 03-05, 2023, pp. 1-4, DOI: https://doi.org/10.1109/SMACD58065.2023.10192176  
Reference
  1077. Hörbarmachung von Ultraschallsignalen  
Peter Holstein, Nicki Bader A. Tharandt R. John S. Uziel D. Januszko T. Hutschenreuther Fortschritte der Akustik - DAGA 2016, 42. Jahrestagung für Akustik, 14.-17. März 2016  
Reference
  1078. HoLoDEC  
Close-up of a milling machine to which an approximately 2 x 2 cm small wireless circuit board with sensors and an illuminated LED is held. IMMS researches ultra-low-power architectures (ULP) and circuit concepts as well as energy-efficient edge-AI systems with overall system energy modeling  
Reference
  1080. Hochtemperatur-Wafertest bis 300°C  
Marco Reinhard, Ulrich Liebold André Richter Ingo Gryl 28. GMM/GI/ITG Workshop – Testmethoden und Zuverlässigkeit von Schaltungen, TuZ 2016, 06.03.2016 - 08.03.2016, Siegen, Germany  
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