Current Publication
Investigations of metal systems in a silicon ceramic composite substrate for electrical and thermal contacts as well as associated mounting aspects
Michael Fischer1, T. Welker1, Bianca Leistritz2, Christoph Schäffel2, Martin Hoffmann1, Jens Müller1
Ceramic Interconnect and Ceramic Microsystems Technologies, Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), , Denver, Colorado, USA, pp. 000107-000110, DOI: dx.doi.org/10.4071/2016CICMT-WA22
1Technical University of Ilmenau, Institute for Micro- and Nanotechnologies (IMN) MacroNano®, 98684 Ilmenau, P.O. Box 10 05 65, Germany, 2IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, Germany
Related content
Project
MUSIK
IMMS has investigated, modelled and validated MEMS characteristics to develop basic blocks for a universally applicable method for MEMS design.
Award