Current Publication
Investigations of metal systems in a silicon ceramic composite substrate for electrical and thermal contacts as well as associated mounting aspects
M. Fischer1.
T. Welker1.
B. Leistritz2.
S. Gropp1.
C. Schäffel2.
M. Hoffmann1.
J. Müller1.
Ceramic Interconnect and Ceramic Microsystems Technologies, Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT): May 2016, Vol. 2016, No. CICMT, pp. 000107-000110, DOI: dx.doi.org/10.4071/2016CICMT-WA22
1Technische Universität Ilmenau, IMN MacroNano®, Ilmenau, Germany.
2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, D-98693 Ilmenau, Germany.
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Project
MUSIK
IMMS has investigated, modelled and validated MEMS characteristics to develop basic blocks for a universally applicable method for MEMS design.
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