IMMS - Search

Reference

841. HoLoDEC

Close-up of a milling machine to which an approximately 2 x 2 cm small wireless circuit board with sensors and an illuminated LED is held.

IMMS researches ultra-low-power architectures (ULP) and circuit concepts as well as energy-efficient edge-AI systems with overall system energy modeling

Reference

842. Hörbarmachung von Ultraschallsignalen

Peter Holstein, Nicki Bader A. Tharandt R. John S. Uziel D. Januszko T. Hutschenreuther Fortschritte der Akustik - DAGA 2016, 42. Jahrestagung für Akustik, 14.-17. März 2016

Reference

843. Hot Fuzz: Assisting verification by fuzz testing microelectronic hardware

Henning Siemen, Jonas Lienke Georg Gläser 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Funchal, Portugal, July 03-05, 2023, pp. 1-4, DOI: https://doi.org/10.1109/SMACD58065.2023.10192176

Reference

844. HoTSens

Tests for an ASIC developed by IMMS for extremely precise measurements in very hot environments. Photograph: IMMS.

Integrated sensors and microelectronics operate at 300°C, enabling more efficient processes

Reference

845. HTS Multilayer Technology for Optimal Bit-Error Rate RSFQ Cells

D. Cassel, Th.Ortlepp K.S.Ilin G.Pickartz B.Kuhlmann R.Dittmann H. Töpfer IEEE Trans. Appl. Supercond., 13(2003) 2, S. 409-412

Reference

846. HTS SFQ circuit design

H.Töpfer, Hitachi Central Research Laboratory, 14.11.2002, Tokyo, Japan

Reference

847. HW/SW-Co-Entwurf einer intelligenten Sensor-Schnittstelle mit Hilfe eines schnellen, Zyklenzahl-genauen, RTL-nahen Befehlssatz-Simulators

Gregor Nitsche, Eckhard Hennig Georg Gläser 15. Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV), 2012, Kaiserslautern, 05.03.2012-07.03.2012

Reference

848. Hybrid scheme to enable DTN routing protocols to efficiently exploit stable MANET contacts

Silvia Krug, Matthias Aumüller Jochen Seitz EURASIP Journal on Wireless Communications and Networking, Volume 2018, Article number: 237 (2018), https://doi.org/10.1186/s13638-018-1248-5

Service for R&D

849. IC design methods

Use our methods, tools and advice for your complex circuits and systems to achieve your goal efficiently. Photograph: IMMS.

Service for R&D: IC design methods. We develop new AI-based methods and tools for your system-on-chip and FPGA designs to master the increasing complexity of integrated systems and thus further increase performance.

Reference

850. IC-Entwicklung: Effizientere Simulation mit KI-basierter Modellfehlerschätzung

Henning Siemen, Martin Grabmann Eric Schäfer Georg Gläser Elektronik, 17-18/2023, 23. August 2023, Seite 66 - 69, ePaper: https://wfm-publish.blaetterkatalog.de/frontend/mvc/catalog/by-name/ELE?catalogName=ELE2317D