2169 results
Reference
  2161. PIC-PAM  
Integrated optical circuit with fibre-optic connections (top and bottom) Photonic integrated circuits for quantum key distribution to protect against cyberattacks: Design of a time-tagging ASIC with a photonic integrated polarisation analysis unit  
Press release
  2162. Quantum key distribution with photonic integrated circuits to protect against cyberattacks  
Group photo inside a building Six research and industry partners from Thüringen launch the PIC-PAM project  
Event
  2163. ISSW 2026  
A circuit board with an unencapsulated microelectronic chip, leaving the bond wires and chip structures visible The International SPAD Sensor Workshop  
Reference
  2164. Einsatz energieautarker Sensorsysteme in industriellen und landwirtschaftlichen Anwendungen  
Tino Hutschenreuther, VDI/VDE (GMA) 78. Stammtisch „Automatisierungstechnik”, 3. Juni 2026, Jena, Germany  
Reference
  2165. Integrated SPAD-Based Entropy Source Using an On-Chip Trigger Diode for QRNG (Quantum Random Number Generator)  
Benjamin Saft, Alexander Zimmer Jakob Hampel Daniel Gäbler Maximilian Wiener Eric Schäfer The International SPAD Sensor Workshop (ISSW) 2026, June 1-4, 2026, Yonsei University, Seoul, South Korea  
Event
  2166. Ilmenau Science Night 2026  
Science night at IMMS. Photograph: IMMS. On 20 June 2026, the diversity of science and business will be brought to life throughout Ilmenau – vividly, excitingly and interactively. We cordially invite you to IMMS, Ehrenbergstraße 27, 98693 Ilmenau!  
Event
  2167. SMACD 2026  
The International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design  
Event
  2168. EMV-Seminar 2026  
open plastic box with connected circuit boards, battery, and antenna Kostenlose Weiterbildung der Würth Elektronik eiSos GmbH & Co. KG und des IMMS  
Event
  2169. CADFEM 2026  
Symbolic image with parts of a precision drive, a model of a magnetic coil whose data is fed into or generated from an AI visualised as a chip with brain structures. CADFEM World Conference 2026: Simulation, Silicon, Systems – powered by AI  
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