1941. The sound of ultrasound   Nicki Bader, Peter Holstein Hans-Joachim Münch Sebastian Uziel Tino Hutschenreuther Steffen Seitz 26th International Congress on Sound and Vibration (ICSV26), 7 - 11 July 2019, Montréal, Canada, ISBN: 9781510892699  

  1942. Themenkreis Virtual Test und automatische Testplangenerierung aus ATML   D. Glaser, P. Lu K. Helmreich I. Gryl M. Meister A. Lechner M. Jegler Z. Kiss Virtuelle Instrumente in der Praxis VIP 2010, 27.10.-28.10.2010, München, Proceedings  

  1943. There is a limit to everything: Automated AMS Operating condition check Generation on System Level   Georg Gläser, Martin Grabmann Gerrit Kropp Andreas Fürtig Integration, Volume 63, 2018, Pages 383-391, ISSN 0167-9260, DOI: https://doi.org/10.1016/j.vlsi.2018.02.016  

  1944. Thermal Analysis of a Coil Assembly in a Nanopositioning Drive System via Reduced-Complexity CFD Modeling   Ina Naujokat, Ludwig Herzog Steffen Hesse Parastoo Salimitari Applied Sciences 2026, 16, 2748. DOI: https://doi.org/10.3390/app16062748  

  1945. Thermal Channel Noise of quarter and sub-quarter micron NMOS FET's   G. Knoblinger, P. Klein U. Baumann ICMTS 2000, USA, CA, Monterey, März 2000  

  1946. Thermal Modeling and Measurement of a Power Amplifier Module for a Silicon-Ceramic Substrate   Astrid Frank, V. Silva Cortes Steffen Michael A. Hagelauer G. Fischer 2018 11th German Microwave Conference (GeMiC), Freiburg, 12-14 March 2018, pp. 79-82. DOI: https://doi.org/10.23919/GEMIC.2018.8335033  

  1948. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors   Ralf Lerner, Klaus Heinrich Marco Erstling Peter Kornetzky 14th International Seminar on Power Semiconductors (ISPS), 29-31 August 2018, Prague, Czech Republic