1801. Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration   Michael Fischer, Sebastian Gropp Johannes Stegner Astrid Frank Martin Hoffmann Jens Mueller in IEEE Microwave Magazine, vol. 20, no. 10, pp. 28-43, Oct. 2019. DOI: https://doi.org/10.1109/MMM.2019.2928675  

  1802. Silicon-On-Insulator circuits for application at high temperatures   S. Bormann, V. Nakov D. Nuernbergk S. Richter S. Richter V. Schulze D. Flandre et al. (eds.), Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Enviroment, pa: 145-154, Kluwer Academic Publishers, Januar 2005  

  1803. Silicon-On-Insulator circuits for application at high temperatures   S. Bormann, V. Nakov D. Nuernbergk S. Richter S. Richter V. Schulze Workshop 'SOI NATO Advanced Research', 25-30.04.2004, Kiev, Ukraine  

  1805. Simulation Tools for Wireless Sensor Network Evaluation in Vehicular Environments   Silvia Krug, Jochen Seitz Hannes Toepfer Yulia Lapteva Mikhail S. Kupriyanov Sense.Enable. SPITSE - Symposium 2014, 07.07.2014 - 11.07.2014, Ilmenau, Vortrag  

  1806. Simulation-Driven Impact Analysis of Layout Parasitics in AMS Circuits   Georg Gläser, Benjamin Saft André Jäger Martin Grabmann Ralf Sommer CDNLive, Cadence User Conference 2017, 15-17 May 2017, Munich, Germany  

  1807. Single-Input Rail-to-Rail Voltage-to-Current Converter Consisting of Three Complementary MOS Transistor Pairs   R. Izak, Proceedings of 2nd Electronic Circuits & System Conference, Slovakia, Bratislava, Seiten 193-198, September 1999  

  1808. Single-Stage Single-Switch AC-DC Power Factor Correction Converter with Low Output Voltage (3.3 V)   H. Wei, G. Zhu I. Bartaseh C. Iannello P. Kornetzky ISLAS, Orlando, Mai 1999