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Reference

1231. High-Frequency Performance of GaN High-Electron Mobility Transistors on 3C-SiC/Si Substrates With Au-Free Ohmic Contacts

Wael Jatal, Uwe Baumann, Katja Tonisch, Frank Schwierz, Jörg Pezoldt, 2015 IEEE Electron Device Letters

Reference

1232. S4ECoB

The embedded platform for acoustic signal processing being put into operation. Photograph: IMMS.

The embedded platform developed by IMMS processes acoustic signals and is part of a system that improves the energy-efficiency of public buildings.

Press release

1233. Intelligent measuring clamp detects parasitic currents in industrial plant

In a project with its partner Indu-Sol, IMMS developed the intelligent measuring clamp 'EMCheck® ISMZ I'. Photograph: IMMS.

Presented by IMMS at the embedded world 2015, Hall 4, Booth 160 (OSADL joint booth).

Reference

1234. MUSIK

IMMS investigated and modelled MEMS and BAW resonater characteristics to develop basic blocks for MEMS design. Photograph: IMMS.

IMMS has investigated, modelled and validated MEMS characteristics to develop basic blocks for a universally applicable method for MEMS design.

Reference

1235. Integriertes elektrostatisches MEMS-Energy-Harvesting-Modul

Benjamin Saft, 2015 Fachzeitschrift Mechatronik 1-2

Reference

1236. sMobiliTy

Installation of a wireless traffic sensor in Erfurt, Germany. Photograph: IMMS.

The wireless sensor system developed by IMMS to contribute to mobility with electric vehicles.

Reference

1237. Perforated plates of inertial sensors – modeling by effective material properties

Steffen Michael, Astrid Frank, G. Hölzer, G. Lorenz, 2014 Procedia Engineering, EUROSENSORS 2014, the 28th European Conference on Solid-State Transducers

Reference

1238. Vibration energy generators for low-frequency spectral excitations

Bianca Leistritz, Michael Katzschmann, Hannes Toepfer, 2014 Procedia Engineering, EUROSENSORS 2014, the 28th European Conference on Solid-State Transducers

Reference

1239. MEMS-T-Lab

In this test lab IMMS takes highly complex measurements of complete MEMS wafers at a new level of automation. Photograph: IMMS.

In the MEMS-T-Lab, IMMS takes highly complex semi-automated measurements for complete MEMS wafers

Press release

1240. IMMS released a new version of its SENT transmitter IP for next-generation smart sensors in automotive applications

IMMS released a new SENT transmitter IP version. Photograph: IMMS.

SENT is a digital point-to-point communication scheme for use in applications where high-resolution sensor data needs to be transmitted from a sensor to a control unit. It constitutes a low-cost alternative to the LIN and CAN bus standards for the automotive industry, e.g. for the transmission of the exhaust temperature to the engine control unit (ECU). IMMS’ newest release of its SENT transmitter IP “D2026C” now supports the transmission of up to 16-bit data from two independent sensors. The soft IP module is a flexibly configurable implementation of a SENT transmitter according to SAE…