Current Publication
Application of 3-D EM-Simulation in Research of Integrated Inductors, System in Package (SiP) Design and Package Effects
W. Wu1.
M. Isikhan1.
11. ITG/GMM-Fachtagung ANALOG 2010, 22.03.-24.03.2010, Erfurt
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ilmenau.
Poster presentation
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- Integrated sensor systems
- Smart distributed measurement and test systems
- Magnetic 6D direct drives with nm precision
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About us
Research
- Integrated sensor systems
- Smart distributed measurement and test systems
- Magnetic 6D direct drives with nm precision
Imprint/Disclaimer
Privacy statement
Search
Home
Lead applications
- Sensor systems for in-vitro diagnostics
- RFID sensor technology
- Adaptive edge AI systems for industrial application
- IoT systems for cooperative environmental monitoring
- nm measurement and structuring of objects
- Target markets
Career
- Vacancies and application process
- Doctorates
- Internships, jobs, BSc/MSc subjects
- Vocational Training
- Questions and answers
Social Media
Services for research and development
- Integrated Circuits
- IC design methods
- Test and characterisation
- Development of embedded systems
- Development of mechatronic systems
- MEMS – simulation, design and test
- Finite Element Modeling
About us