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Project Regional Growth Core HIPS

Design library, simulations and evaluation circuits for the development of novel, robust and compact SiCer sensors

With the goal of developing innovative, significantly more compact sensors to detect and quantify several physical and chemical characteristics which can be used in aggressive media or harsh environments, Ilmenau TU and the Fraunhofer IKTS have been researching and creating bonded layered substrates with the name SiCer. The technology enables hybrid microsystems to be created by the bonding of silicon (Si) and ceramics (Cer) at wafer level. The SiCer substrate unites the advantages of two types of successful technology and can be integrated into the fabrication process for MEMS. Twelve industrial companies and seven research institutes in Thüringen have been collaborating on building a technology platform for SiCer. The scheme is enabling innovative, robust, highly integrated SiCer high-performance sensors to be developed for liquids and gases with a view to later market launch by the collaborators.

Systematic design procedure for SiCer sensor systems

IMMS is working on new sorts of functional structures for micromechanical sensor and actuator elements, aiming to develop in collaboration with the various partners a systematic design procedure for SiCer sensor systems, including the appropriate design rules. For an assortment of structure and prototype elements, the component and system models are being developed, simulated and tested in partners’ demonstrator versions. The design library elements are part of a model library. They will later serve the design of further innovative multisensor applications.

Processing circuits for infinitesimal sensor signals and metrological evaluation

At IMMS, a further focus is the development of miniaturised processing circuits for partners’ SiCer sensors. This work involves specific electronics matched to the technology used and adapted to analogue capture of the sometimes infinitesimal sensor signals. The IMMS’ tasks include not only design and construction of the electronics but also metrological evaluation and optimisation as well as field testing.

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Acronym / Name:

Regional Growth Core HIPS / High-performance sensor systems by combining silicon technology and ceramic multilayer technology

Duration:2019 – 2022

Application:

Environmental monitoring and smart city applications|Automation technology and Industry 4.0|Life Sciences|Industry 4.0| security| Internet of Things (IoT)| predictive maintenance| environment| (bio-chemical) analytics| process measurement technology| traffic engineering| energy technology

Research field:Integrated sensor systems


Related content

Event,

InnoCON Thüringen 2020

Virtueller Messestand und Vorstellung des Wachstumskerns HIPS


Contact

Contact

Dr.-Ing. Frank Spiller

Interim Head of Mechatronics

frank.spiller(at)imms.de+49 (0) 3677 874 93 61

Dr. Frank Spiller will provide detail on our research on magnetic 6D direct drives with nm precision for the nm measurement and structuring of objects. He supports you with services for the development of mechatronic systems, for simulation, design and test of MEMS as well as for finite element modelling (FEM) and simulation.


Funding

IMMS is funded by the Federal Ministry of Education and Research (BMBF) in the HIPS growth core as part of the “Regional Enterprise” initiative in the joint projects 1 and 2 under the funding codes 03WKDG01E and 03WKDG02H.


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