Chipdesign Germany
DI-Meta-X: Bridging the Gap with Meta Formats
Georg Gläser (IMMS), Melanie Wilhelm (X-Fab), Robert Fischbach (TU Dresden), Detlef Billep (EDC Chemnitz), Jan Mehner (iRom GmbH), Peter Kreutziger (AMAC GmbH)
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Core topic
AI-based design and test automation
We are researching to use AI to make the development process of integrated sensor systems safer and more cost-effective. AI can help developers in the process to avoid errors and apply informal knowledge in an automated way.
Service for R&D
IC design methods
We develop new AI-based methods and tools for your system-on-chip and FPGA designs to master the increasing complexity of integrated systems and thus further increase performance.
Service for R&D
Integrated Circuits
We offer the design and realisation of application-specific integrated circuits (ASICs) in CMOS, BiCMOS and SOI technologies. We achieve well-performing ASICs with our first runs (first-time right silicon).
Research field
Integrated sensor systems
Here we investigate miniaturised systems manufactured in semiconductor technology consisting of microelectronic components for sensors applications, as well as methods to design these highly complex systems efficiently and safely.
Contact
Contact
Dipl.-Hdl. Dipl.-Des. Beate Hövelmans
Head of Corporate Communications
beate.hoevelmans(at)imms.de+49 (0) 3677 874 93 13
Beate Hövelmans is responsible for the text and image editorial work on this website, for the social media presence of IMMS on LinkedIn and YouTube, the annual reports, for press and media relations with regional and specialist media and other communication formats. She provides texts, photographs and video material for your reporting on IMMS, arranges contacts for interviews and is the contact person for events.