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Referenz

231. A Low-Voltage Low-Power CMOS Time-Domain Temperature Sensor Accurate To Within [-0.1,+0.5]˚C From -40˚C To 125˚C

Jun Tan, Alexander Rolapp, Eckhard Hennig, Ishigaki, Japan 2014 2014 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)

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232. A method for dynamic interferometric characterization of air bearings for nanopositioning stages

Steffen Hesse, Michael Katzschmann, Alex S. Huaman, Parastoo Salimitari, Ludwig Herzog, Technische Universität Ilmenau, Ilmenau 2025 Internationales Wissenschaftliches Symposium zum Welttag der Interferometrie

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233. A methodology for high-level design of machine vision systems using SystemC

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234. A modular application specific active test environment for high-temperature wafertest up to 300 °C

Michael Meister, Marco Reinhard, St. Anne’s College in the University of Oxford, Oxford, United Kingdom 2019 International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2019)

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235. A Modular Platform to Build Task Specific IoT Network Solutions for Agriculture and Forestry

Silvia Krug, Marco Götze, Sören Schneider, Tino Hutschenreuther, Pisa, Italy 2023 2023 IEEE International Workshop on Metrology for Agriculture and Forestry (MetroAgriFor)

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236. A New Low Voltage Bandgap Reference Topology

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237. A new tool for industrial tribology - Filling the gap between macro- and nano-tribology

Referenz

238. A new XY linear stage for Nano technology - The stage can draw 3 diameter true circle

Referenz

239. A novel low leakage EEPROM cell for application in an extended temperature range (-40°C up to 225°C)

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240. A novel low leakage EEPROM cell for application in an extended temperature range (-40°C up to 225°C)