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231.
A modular application specific active test environment for high-temperature wafertest up to 300 °C
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232.
A Modular Platform to Build Task Specific IoT Network Solutions for Agriculture and Forestry
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234.
A new tool for industrial tribology - Filling the gap between macro- and nano-tribology
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236.
A novel low leakage EEPROM cell for application in an extended temperature range (-40°C up to 225°C)