Aktuelle Publikation
A modular application specific active test environment for high-temperature wafertest up to 300 °C
Michael Meister1.
Marco Reinhard1.
International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2019), 8 - 10 July 2019, St. Anne’s College in the University of Oxford, Oxford, United Kingdom, DOI: doi.org/10.4071/2380-4491.2019.HiTen.000122
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.