1561. Thermal Channel Noise of quarter and sub-quarter micron NMOS FET's   G. Knoblinger, P. Klein U. Baumann ICMTS 2000, USA, CA, Monterey, März 2000  

  1562. Thermal Modeling and Measurement of a Power Amplifier Module for a Silicon-Ceramic Substrate   Astrid Frank, V. Silva Cortes Steffen Michael A. Hagelauer G. Fischer 2018 11th German Microwave Conference (GeMiC), Freiburg, 12-14 March 2018, pp. 79-82. DOI: https://doi.org/10.23919/GEMIC.2018.8335033  

  1564. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors   Ralf Lerner, Klaus Heinrich Marco Erstling Peter Kornetzky 14th International Seminar on Power Semiconductors (ISPS), 29-31 August 2018, Prague, Czech Republic  

  1568. Timing Accurate Synthesis of Digital SystemC Components in a Mixed-Signal Environment   Georg Gläser, Eckhard Hennig CDNLive2014, 19.05.2014 - 21.05.2014, München, Poster  

  1569. Tip- and laser-based nanofabrication up to 100 mm with sub-nanometre precision   Ingo Ortlepp, Michael Kühnel, Martin Hofmann, Laura Weidenfeller Johannes Kirchner, Shraddha Supreeti Rostyslav Mastylo, Mathias Holz Thomas Michels, Roland Füßl Ivo W. Rangelow, Thomas Fröhlich Denis Dontsov Christoph Schäffel Eberhard Manske Proc. SPIE 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020, 113240A (23 March 2020), DOI: https://doi.org/10.1117/12.2551044  

  1570. Tip-based nanofabrication below 40 nm combined with a nanopositioning machine with a movement range of Ø100 mm   Jaqueline Stauffenberg, Michael Reibe Anja Krötschl Christoph Reuter Ingo Ortlepp Denis Dontsov Steffen Hesse Ivo W. Rangelow Steffen Strehle Eberhard Manske Micro and Nano Engineering, Volume 19, 2023, 100201, ISSN 2590-0072, DOI: https://doi.org/10.1016/j.mne.2023.100201