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1563.
Parameter extraction such as layer thickness and stress at wafer level for process monitoring in semiconductor manufacturing
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1565.
Parameter Identification of MEMS Membrane and Beam Structures by Modal Analysis and Dynamic Measurements
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1566.
Parameter Identification of Piezoelectric AlGaN/GaN Beam Resonators by Dynamic Measurements
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1568.
Parametric Measurement Unit and Pin Electronics for modular Mixed Signal Test Systems