1111. Investigations of metal systems in a silicon ceramic composite substrate for electrical and thermal contacts as well as associated mounting aspects   M. Fischer, T. Welker B. Leistritz S. Gropp C. Schäffel M. Hoffmann J. Müller Ceramic Interconnect and Ceramic Microsystems Technologies, Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT): May 2016, Vol. 2016, No. CICMT, pp. 000107-000110, DOI: http://dx.doi.org/10.4071/2016CICMT-WA22  

  1114. Tri-Gate Al0.2Ga0.8N/AlN/GaN HEMTs on SiC/Si-substrates   Wael Jatal, Uwe Baumann Heiko O. Jacobs Frank Schwierz Jörg Pezoldt Materials Science Forum, ISSN: 1662-9752, Vol. 858, pp 1174-1177, DOI: http://www.scientific.net/MSF.858.1174, ©2016 Trans Tech Publications, Switzerland  

  1118. Intelligente Lösungen für Industrie 4.0 - Diagnose und Überwachung in industriellen Anlagen   Tino Hutschnreuther, 2. Maschinenbautag, 15.06.2016, Erfurt  

  1120. On the Role of Wireless Sensor Networks for Intelligent Transportation Systems   Silvia Krug, Jochen Seitz Elena Chervakova Hannes Toepfer Sense. Enable. SPITSE, 2016, 20.06.2016 - 24.06.2016, Moskau, Russland