131. TSN – ein neuer Vernetzungsstandard für Industrie 4.0   Thomas Elste, Ralf Sommer edaWorkshop 2018, 16.-17. Mai 2018, Hannover  

  132. Trust is Good, Monitoring is Better: FPGA- & TEE-Based Monitoring for Malware-Detection   Friederike Bruns, Georg Gläser Florian Kögler Jonas Lienke Nithin R. Nanjundaswamy Gregor Nitsche Behnam R. Perjikolaei Jörg Walter 13th IMA International Conference on Modelling in Industrial Maintenance and Reliability MIMAR2025, July 8-10, 2025, Université de Lorraine, France, DOI: https://doi.org/10.19124/ima.2025.01.25  

  133. Trust is good, monitoring is better: An FPGA/TEE-Based Monitoring-Approach to Malware Detection and Prevention   Friederike Bruns, Georg Gläser Florian Kögler Jonas Lienke Nithin Ravani Nanjundaswamy Gregor Nitsche Behnam Razi Perjikolaei Jörg Walter edaWorkshop 2024 and the European Nanoelectronics Applications, Design & Technology Conference (ADTC), 9. - 10. April 2024, Dresden, Germany  

  135. Tri-Gate Al0.2Ga0.8N/AlN/GaN HEMTs on SiC/Si-substrates   Wael Jatal, Uwe Baumann Heiko O. Jacobs Frank Schwierz Jörg Pezoldt Materials Science Forum, ISSN: 1662-9752, Vol. 858, pp 1174-1177, DOI: http://www.scientific.net/MSF.858.1174, ©2016 Trans Tech Publications, Switzerland  

  136. Trends in der Sensortechnologie - Einsatz der Sensorik für die Qualitätssicherung   Wolfgang Sinn, Treffen des Regionalkreises Erfurt der Deutschen Gesellschaft für Qualität (DGQ), Ilmenau, 06.07.2012  

  137. Trash or Treasure? Machine-learning based PCB layout anomaly detection with AnoPCB   Henning Franke, Paul Kucera Julian Kuners Tom Reinhold Martin Grabmann Patrick Mäder Marco Seeland Georg Gläser 2021 17th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Proceedings in: 423 Seiten, 140 x 124 mm, Slimlinebox, CD-Rom, ISBN 978-3-8007-5588-2, E-Book: ISBN 978-3-8007-5589-9, https://ieeexplore.ieee.org/document/9547913, 19 - 22 July 2021, Erfurt, Germany, online  

  138. Transimpedanzverstärker optimal dimensionieren   M. Heise, D. Stojkovic Design & Elektronik, Januar 2000  

  139. Transfer der dynamischen Charakterisierung von Fotodioden auf Wafer-Ebene   M. Reinhard, Multi-Nature Systems: Entwicklung von Systemen mit elektronischen und nichtelektronischen Komponenten, 7. GI/GMM/ITG-Workshop, 3. Februar 2009, Ulm, Germany  

  140. Trade-off between Spectral Feature Extractors for Machine Health Prognostics on Microcontrollers   Umut Onus, Sebastian Uziel Tino Hutschenreuther Silvia Krug 2022 IEEE 9th International Conference on Computational Intelligence and Virtual Environments for Measurement Systems and Applications (CIVEMSA), 2022, pp. 1-6, DOI: https://doi.org/10.1109/CIVEMSA53371.2022.9853642, 15 - 17 June 2022, Chemnitz, Germany