2115 Ergebnisse
Referenz
  1341. An Extensible Platform for Smart Home Services  
Marco Götze, Wolfram Kattanek Rolf Peukert In Faouzi Derbel, Nabil Derbel, Olfa Kanoun (Eds.), Communication and Signal Processing: Extended Papers (pp. 61–80). Berlin, Boston: De Gruyter, 2018, DOI: https://doi.org/10.1515/9783110470383-005, Book DOI: https://doi.org/10.1515/9783110470383, Online ISBN: 9783110470383  
Referenz
  1342. Monolithic Integrated CMOS Ambient Light Sensor  
Michael Meister, Ulrich Liebold André Jäger Sebastian Thiele R. Weirauch D. Gäbler Konrad Bach (2018). In Olfa Kanoun, Nabil Derbel, Faouzi Derbel (Eds.), Sensors, Circuits & Instrumentation Systems: Extended Papers 2017 (pp. 217–226). Berlin, Boston: De Gruyter. DOI: https://doi.org/10.1515/9783110448375-014, Book DOI: https://doi.org/10.1515/9783110448375, Online ISBN: 9783110448375  
Referenz
  1343. A Distributed Sensor Network for Monitoring Noise Level and Noise Sources in Urban Environments  
Jakob Abeßer, Robert Gräfe Christian Kühn Tobias Clauß Hanna Lukashevich Marco Götze Stephanie Kühnlenz 2018 IEEE 6th International Conference on Future Internet of Things and Cloud (FiCloud), Barcelona, 6-8 August 2018, pp. 318-324. DOI: https://doi.org/10.1109/FiCloud.2018.00053  
Referenz
  1344. Impact Rating of Layout Parasitics in Mixed-Signal Circuits: Finding a Needle in a Haystack  
Georg Gläser, Martin Grabmann Dirk Nuernbergk 2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Prague, 2-5 July 2018, pp. 149-152. DOI: https://doi.org/10.1109/SMACD.2018.8434844  
Veranstaltung
  1345. ISPS 2018  
14th International Seminar on Power Semiconductors  
Veranstaltung
  1346. 6. Workshop „Sensorik 4.0“  
„Ein Schritt in Richtung Industrie 4.0 - Industrie-4.0-konforme Kommunikation mit OPC-UA“, Auftakt zu einer dreiteiligen Veranstaltungsreihe zum Thema OPC-UA  
Referenz
  1347. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors  
Ralf Lerner, Klaus Heinrich Marco Erstling Peter Kornetzky 14th International Seminar on Power Semiconductors (ISPS), 29-31 August 2018, Prague, Czech Republic  
Referenz
  1348. Design and Performance of Power Amplifier Integration with BAW Filter on a Silicon-Ceramic Composite and Standard Epoxy/Glass Substrate  
Vikrant Chauhan, Wilfried Wandji Xuejiao Peng Victor Silva Cortes Astrid Frank Michael Fischer Uwe Stehr Robert Weigel Amelie Hagelauer 2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Ann Arbor, MI, 2018, 16-18 July, pp. 1-3. DOI: https://doi.org/10.1109/IMWS-AMP.2018.8457140  
Veranstaltung
  1349. FDL 2018  
Forum on specification & Design Languages  
Veranstaltung
  1350. Analog 2018  
16. GMM/ITG-Fachtagung befasst sich mit allen Teilgebieten des Entwurfs, der Integration und der Anwendung analoger, gemischt analog/digitaler und hochfrequenter Schaltungen und Systeme.  
Suchergebnis 1341 bis 1350 von 2115