1754 Ergebnisse
Referenz
  831. High-Frequency Performance of GaN High-Electron Mobility Transistors on 3C-SiC/Si Substrates With Au-Free Ohmic Contacts  
Wael Jatal, Uwe Baumann Katja Tonisch Frank Schwierz Jörg Pezoldt Electron Device Letters, IEEE, Volume:36, Issue: 2, Page(s) 123-125, DOI: http://dx.doi.org/10.1109/LED.2014.2379664  
Referenz
  832. High-level Modeling für analoge Module mit SystemC  
E. Ulicna, In: 7.Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, S. 36-39. Technische Universität Chemnitz, 2005  
Referenz
  833. High-level Modeling für analoge Module mit SystemC  
E. Ulicna, 26.10.2005, 7.Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz  
Referenz
  834. High-Precision Mixed-Signal Sensor Interface for a Wide Temperature - Range [0°-300°C]  
Georg Gläser, Dirk M. Nuernbergk Dagmar Kirsten André Richter Marco Reinhard Gerrit Kropp International Conference and Exhibition on High Temperature Electronics Network, HiTen 2017, 10-12 July 2017, Queens College, Cambridge, UK  
Referenz
  835. High-Precision Mixed-Signal Sensor Interface for a Wide Temperature Range [0° – 300°C]  
Georg Gläser, Dagmar Kirsten André Richter Marco Reinhard Gerrit Kropp Dirk M. Nuernbergk Journal of Microelectronics and Electronic Packaging, January 2018, Vol. 15, No. 1, pp. 1-8, DOI: https://doi.org/10.4071/imaps.523847  
Referenz
  836. High-Sensitive Demodulator with Built-in Negative Offset Comparator for Passive UHF RFID Tags  
Rohit Kesharwani, Andre Jäger Martin Grabmann Georg Gläser Eric Schäfer IEEE RFID-TA 2024, Forum for advancing RFID technology and practice, Daytona Beach, FL, USA, December 18–20, 2024  
Referenz
  837. High-Sensitive Demodulator with Built-in Negative Offset Comparator for Passive UHF RFID Tags  
Rohit Kesharwani, Andre Jäger Martin Grabmann Georg Gläser Eric Schäfer 2024 IEEE International Conference on RFID Technology and Applications (RFID-TA), Daytona Beach, FL, USA, 2024, pp. 109-112, DOI: https://doi.org/10.1109/RFID-TA64374.2024.10965142  
Referenz
  838. Highspeed optoelectronic interface for RSFQ superconductive electronics  
S. Badi, P. Febvre, H. Eusebe, J.F. Roux, J.L. Coutaz, A. Krotkus, B. Ebert, Dr. H. Töpfer Th. Ortlepp, F.H. Uhlmann, J. Kunert, L. Fritzsch, H.-G. Meyer 5th SCENET School Superconducting Materials and Applications, 30.8.-10.9. 2004, Salamanca, Spanien  
Referenz
  839. Hinters Licht geführt – Optical Wireless Links  
Christian Jordan, Andreas Bluschke Ralf Boden Ulrich Liebold Philipp Rietzsch 11. ITG Fachkonferenz Breitbandversorgung, 29.-30. März 2017, Fraunhofer Heinrich-Hertz-Institut, Berlin  
Referenz
  840. Hitzefest - Design von Mixed-Signal-Hochtemperatur-ICs  
St. Richter, W. Göttlich D. Nuernbergk V. Nakov S. Bormann Design & Elektronik, Sonderdruck, S. 56f, März 2002  
Suchergebnis 831 bis 840 von 1754