1881. A new XY linear stage for Nano technology - The stage can draw 3 diameter true circle   F. Spiller, O. Mollenhauer Tokyo/Japan, Advanced Photonics Technology Exhibition, November 2003  

  1882. A new tool for industrial tribology - Filling the gap between macro- and nano-tribology   S. Achanta, D. Drees J.-P. Celis O. Mollenhauer F. Spiller 14th International Colloquium 'Tribology and Lubrication Engineering', Esslingen, January 13-15 2004  

  1883. A New Low Voltage Bandgap Reference Topology   M. Isikhan, T. Reich A. Richter E. Hennig International Conference on Electronics Circuits and Systems, 13.-16. Dezember, 2009, Hammamet, Tunesien  

  1884. A Modular Platform to Build Task Specific IoT Network Solutions for Agriculture and Forestry   Silvia Krug, Marco Goetze Sören Schneider Tino Hutschenreuther 2023 IEEE International Workshop on Metrology for Agriculture and Forestry (MetroAgriFor), Pisa, Italy, November 06-08, 2023, pp. 820-825, DOI: https://doi.org/10.1109/MetroAgriFor58484.2023.10424104  

  1885. A modular application specific active test environment for high-temperature wafertest up to 300 °C   Michael Meister, Marco Reinhard International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2019), 8 - 10 July 2019, St. Anne’s College in the University of Oxford, Oxford, United Kingdom, DOI: https://doi.org/10.4071/2380-4491.2019.HiTen.000122  

  1886. A methodology for high-level design of machine vision systems using SystemC   F. Czerner, J. Zellmann Synopsis User Group Meeting (SNUG), 4.- 8. March 2002, Paris  

  1887. A method for dynamic interferometric characterization of air bearings for nanopositioning stages   Steffen Hesse, Michael Katzschmann Alex Huaman Parastoo Salimitari Ludwig Herzog Internationales Wissenschaftliches Symposium zum Welttag der Interferometrie, 8. - 9. April 2025, Technische Universität Ilmenau, Ilmenau  

  1888. A Low-Voltage Low-Power CMOS Time-Domain Temperature Sensor Accurate To Within [-0.1,+0.5]˚C From -40˚C To 125˚C   Jun Tan, Alexander Rolapp Eckhard Hennig 12th IEEE Asia Pacific Conference on Circuits and Systems (APCCAS 2014), Session Sensor Systems and Emerging Memory Technology, pp. 463 – 466, IEEE Catalog Number: CFP14APC-USB, ISBN: 978-1-4799-5229-8, Ishigaki Island, Okinawa, Japan  

  1889. A Fully Passive RFID Temperature Sensor SoC With An Accuracy Of ±0.4 °C (3σ) From 0 °C To 125 °C   Jun Tan, Muralikrishna Sathyamurthy Alexander Rolapp Jonathan Gamez Eckhard Hennig Eric Schäfer Ralf Sommer in IEEE Journal of Radio Frequency Identification, vol. 3, no. 1, pp. 35-45, March 2019. DOI: https://doi.org/10.1109/JRFID.2019.2896145  

  1890. A Fully Passive RFID Temperature Sensor SoC With An Accuracy Of ±0.4 °C (3σ) From 0 °C To 125 °C   Jun Tan, Muralikrishna Sathyamurthy Alexander Rolapp Jonathan Gamez Eckhard Hennig Ralf Sommer 2018 IEEE International Conference on RFID (RFID), Orlando, FL, USA, 10-12 April 2018, pp. 1-8. DOI: https://doi.org/10.1109/RFID.2018.8376198