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Referenz
1551.
Parameter extraction such as layer thickness and stress at wafer level for process monitoring in semiconductor manufacturing
Referenz
1553.
Parameter Identification of MEMS Membrane and Beam Structures by Modal Analysis and Dynamic Measurements
Referenz
1554.
Parameter Identification of Piezoelectric AlGaN/GaN Beam Resonators by Dynamic Measurements
Referenz
1556.
Parametric Measurement Unit and Pin Electronics for modular Mixed Signal Test Systems