1551. There is a limit to everything: Automated AMS Operating condition check Generation on System Level   Georg Gläser, Martin Grabmann Gerrit Kropp Andreas Fürtig Integration, Volume 63, 2018, Pages 383-391, ISSN 0167-9260, DOI: https://doi.org/10.1016/j.vlsi.2018.02.016  

  1552. Thermal Channel Noise of quarter and sub-quarter micron NMOS FET's   G. Knoblinger, P. Klein U. Baumann ICMTS 2000, USA, CA, Monterey, März 2000  

  1553. Thermal Modeling and Measurement of a Power Amplifier Module for a Silicon-Ceramic Substrate   Astrid Frank, V. Silva Cortes Steffen Michael A. Hagelauer G. Fischer 2018 11th German Microwave Conference (GeMiC), Freiburg, 12-14 March 2018, pp. 79-82. DOI: https://doi.org/10.23919/GEMIC.2018.8335033  

  1555. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors   Ralf Lerner, Klaus Heinrich Marco Erstling Peter Kornetzky 14th International Seminar on Power Semiconductors (ISPS), 29-31 August 2018, Prague, Czech Republic  

  1559. Timing Accurate Synthesis of Digital SystemC Components in a Mixed-Signal Environment   Georg Gläser, Eckhard Hennig CDNLive2014, 19.05.2014 - 21.05.2014, München, Poster  

  1560. Tip- and laser-based nanofabrication up to 100 mm with sub-nanometre precision   Ingo Ortlepp, Michael Kühnel, Martin Hofmann, Laura Weidenfeller Johannes Kirchner, Shraddha Supreeti Rostyslav Mastylo, Mathias Holz Thomas Michels, Roland Füßl Ivo W. Rangelow, Thomas Fröhlich Denis Dontsov Christoph Schäffel Eberhard Manske Proc. SPIE 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020, 113240A (23 March 2020), DOI: https://doi.org/10.1117/12.2551044