1191. What is Industry-4.0-compliant communication and how can it be realized in an energy-aware manner?   Frank Senf, International Summer School on Advanced Technologies based on Internet of Things (ATIoT), Tutorial: Benefits and Challenges of Energy Self-Sufficient Wireless Sensor Systems for Industry-4.0 Applications, 21-28 June 2018, Chemnitz  

  1192. What needs to be considered when designing efficient electromagnetic harvesters?   Bianca Leistritz, International Summer School on Advanced Technologies based on Internet of Things (ATIoT), Tutorial: Benefits and Challenges of Energy Self-Sufficient Wireless Sensor Systems for Industry-4.0 Applications, 21-28 June 2018, Chemnitz  

  1195. An Extensible Platform for Smart Home Services   Marco Götze, Wolfram Kattanek Rolf Peukert In Faouzi Derbel, Nabil Derbel, Olfa Kanoun (Eds.), Communication and Signal Processing: Extended Papers (pp. 61–80). Berlin, Boston: De Gruyter, 2018, DOI: https://doi.org/10.1515/9783110470383-005, Book DOI: https://doi.org/10.1515/9783110470383, Online ISBN: 9783110470383  

  1196. Monolithic Integrated CMOS Ambient Light Sensor   Michael Meister, Ulrich Liebold André Jäger Sebastian Thiele R. Weirauch D. Gäbler Konrad Bach (2018). In Olfa Kanoun, Nabil Derbel, Faouzi Derbel (Eds.), Sensors, Circuits & Instrumentation Systems: Extended Papers 2017 (pp. 217–226). Berlin, Boston: De Gruyter. DOI: https://doi.org/10.1515/9783110448375-014, Book DOI: https://doi.org/10.1515/9783110448375, Online ISBN: 9783110448375  

  1197. Digitaler Temperatursensor   Jun Tan, DE 10 2013 205 255 B4  

  1198. A Distributed Sensor Network for Monitoring Noise Level and Noise Sources in Urban Environments   Jakob Abeßer, Robert Gräfe Christian Kühn Tobias Clauß Hanna Lukashevich Marco Götze Stephanie Kühnlenz 2018 IEEE 6th International Conference on Future Internet of Things and Cloud (FiCloud), Barcelona, 6-8 August 2018, pp. 318-324. DOI: https://doi.org/10.1109/FiCloud.2018.00053  

  1199. Impact Rating of Layout Parasitics in Mixed-Signal Circuits: Finding a Needle in a Haystack   Georg Gläser, Martin Grabmann Dirk Nuernbergk 2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Prague, 2-5 July 2018, pp. 149-152. DOI: https://doi.org/10.1109/SMACD.2018.8434844  

  1200. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors   Ralf Lerner, Klaus Heinrich Marco Erstling Peter Kornetzky 14th International Seminar on Power Semiconductors (ISPS), 29-31 August 2018, Prague, Czech Republic