GeMiC 2015 in Nürnberg

Vortrag, Mittwoch, 18.03.2015, 09:15, SP4.4: Modeling of BAW filters for system level simulation

Dominik Karolewski¹, Andreas Tag², Victor Silva Cortes³, Christoph Schäffel¹, Amelie Hagelauer², Georg Fischer²

¹Institut für Mikroelektronik- und Mechatronik-Systeme GmbH, Germany; ²University of Erlangen-Nuremberg, Germany; ³Friedrich-Alexander-Universität Erlangen-Nürnberg, Germany

Abstract:

A behavioral model of a BAW resonator realized in VerilogA is presented. VerilogA models can be integrated in all leading RF design tools allowing simulations of BAW filters at a system and circuit level. In that way a coupled design of the conventional electronics and the electro-mechanical BAW is now possible. By using the presented model the system designer has the possibility to optimize both the conventional electronic and BAW components according to the system requirements simultaneously. The VerilogA model has been verified by performing optimization in Cadence and ADS.

Vortrag, Mittwoch, 18.03.2015, 09:30, SP4.5: Electrostatic parallel-plate MEMS Switch on Silicon-Ceramic-Composite-Substrates

Sebastian Gropp¹, Michael Fischer¹, Martin Hoffmann², Jens Müller¹, Astrid Frank³, Christoph Schäffel⁴

¹Ilmenau University of Technology, Germany; ²Technische Universität Ilmenau, Germany; ³IMMS Institut für Mikroelektronik- und Mechatronik-Systeme Gemeinnuetzige GmbH, Germany; ⁴Institut für Mikroelektronik- und Mechatronik-Systeme GmbH, Germany

Abstract:

In this work we will present the capabilities of this monolithic SiCer (silicon on ceramics) [1] compound by producing a parallel-plate RF-MEMS switch with flexible electrodes and integrated coplanar waveguides. The series switch is one part of a LTE demonstrator and is developed in a heterogeneous process design. Here, the aim is to create a low-voltage switch for mobile use with a simple layout. The modelling and simulation of the parallel-plate switch with flexible electrodes is carried out using ANSYS (electro-mechanical simulation) and CADENCE (circuit simulation). To demonstrate the advantages of the composite substrate, the coplanar waveguides for the RF-signal and the control lines for the actuation of the electrostatic parallel plates of the switch are processed by screen printing them on the LTCC tapes before sintering the composite. The relocation of the waveguides into the LTCC avoids damping influences on RF signals by the silicon. An optimal process flowchart for modifying the silicon surface is shown through which bond areas with a homogeneous bond strength between silicon and LTCC are achieved and certain areas with cavities at the bond interface can be produced.