701. Learn from error! ML-based model error estimation for design verification without false-positives   Henning Siemen, Martin Grabmann Georg Gläser 2022 18th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2022, pp. 1-4, DOI: https://doi.org/10.1109/SMACD55068.2022.9816317, 12 - 15 June 2022, Villasimius, Sardinia, Italy  

  702. Latency Critical IoT Applications in 5G: Perspective on the Design of Radio Interface and Network Architecture   Philipp Schulz, Maximillian Matthé, Henrik Klessig, Gerhard Fettweis, Meryem Simsek Junaid Ansari, Shehzad Ali Ashraf Björn Almeroth Jens Voigt, Ines Riedel Andre Puschmann, Andreas Mitschele-Thiel Michael Müller Thomas Elste Marcus Windisch IEEE Communications Magazine, February 2017, vol. 55, no. 2, pages 70-78, February 2017, DOI: http://doi.org/10.1109/MCOM.2017.1600435CM  

  704. La petite puce – Customized Chip Design for optical and wireless Sensors   Peggy Reich, Tech Biz Day – From Innovation to Medical Electronics, 17 October 2019, Lyon, France  

  705. Kurzvorstellung der Forschergruppe GreenSense   Komla Agla, Sven Engelhardt Stefan Hampl Eckhard Hennig Bianca Leistritz Alexander Rolapp Benjamin Saft Jun Tan Jahrestagung der Thüringer Forschergruppe, Technische Universität Ilmenau, 11.09.2013  

  708. Kreuzgelenk   V. Bornmann, Deutsche Patentmeldung DE 103 26 978.9, Juli 2003