1801. Applying OPC-UA for Factory-Wide Industrial Assistance Systems   Björn Barig, Kaja Balzereit Tino Hutschenreuther 2019 15th IEEE International Workshop on Factory Communication Systems (WFCS), 27 - 29 May 2019, Sundsvall, Sweden, 2019, pp. 1-4. DOI: https://doi.org/10.1109/WFCS.2019.8757868  

  1802. Applying Event-Based Sending Intervals to Enable Low Energy OPC-UA on Sensor Nodes   Jurgen Troci, Silvia Krug Tino Hutschenreuther 2019 27th Telecommunication Forum (TELFOR), 26 - 27 November 2019, Belgrade, Serbia, pp. 1-4. DOI: https://doi.org/10.1109/TELFOR48224.2019.8971257  

  1803. Applikationsspezifischer Entwurf mechatronischer Direktantriebe   Dr. F. Spiller, ELMUG-Technologiekonferenz 'elmug4future', 23.06.2010, Suhl  

  1804. Application of Wireless Sensors Within a Traffic Monitoring System   Hannes Toepfer, Elena Chervakova Marco Götze Tino Hutschenreuther Bojana Nikolić Bojan Dimitrijević International 23rd Telecommunications Forum, TELFOR 2015, 24 - 26 Nov. 2015, Pages 236 - 241, invited paper, ISBN: 978-1-5090-0055-5, Serbia, Belgrade  

  1805. Application of the Expert Design Plan Methodology on an Ultra-Low-Power Sensor Frontend   Lorenz Renner, Ralf Sommer Yannick Uhlmann 2025 21th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), July 7-10, 2025, Istanbul, Turkiye, pp. 1-4, DOI: https://doi.org/10.1109/SMACD65553.2025.11092185  

  1806. Application of Symbolic Circuit Analysis for Failure Detection and Optimization of Industrial Integrated Circuits   Ralf Sommer, Dominik Krauße Eric Schäfer Eckard Hennig in Design of Analog Circuits through Symbolic Analysis, M. Fakhfakh, E. Tlelo-Cuautle, and F. V. Fernández, Eds., Bentham Science Publishers, 2012, ch. 17, Pages 445-477, http://www.eurekaselect.com/101990/volume/1  

  1807. Application of Symbolic Analysis in Industrial Circuit Design   R. Sommer, geladener Vortrag auf der FDL'06, Forum on Specification and Design Languages, 9/2006  

  1808. Application of a Modular Test System for Mixed Signal Tests   I. Gryl, V. Schulze Chip, Packaging, Design, Simulation and Test ? International Conference, Workshop and Table-top Exhibition 'Semiconductor Conference Dresden 2009' (SCD 2009), 29. - 30. April 2009, Dresden  

  1809. Application of 3-D EM-Simulation in Research of Integrated Inductors, System in Package (SiP) Design and Package Effects   W. Wu, M. Isikhan 11. ITG/GMM-Fachtagung ANALOG 2010, 22.03.-24.03.2010, Erfurt  

  1810. Application of 3-D EM Simulation in Research of Integrated Inductors, System in Package (SiP) Design and Package Effects   W. Wu, M. Isikhan 11. ITG/GMM-Fachtagung ANALOG 2010, 22.03.-24.03.2010, Erfurt, in Proceedings