1001. High reliability EEPROM design for high-temperature applications   D. Kirsten, S. Richter D. Nuernbergk St. Richter Second Workshop of the Thematic Network on Silicon on Insulator technology, devices and circuits (EUROSOI), Grenoble, Frankreich, 8.-10. März, 2006  

  1002. High Speed Backplane   B. Bieske, Ilmenau, November 2000  

  1003. High Voltage RF-Multiplexer for Medical Applications   Bjoern Bieske, Dagmar Kirsten Sensorica 2017, IEEE Workshop, http://d-nb.info/1137195215, 8-9 June 2017, Mülheim an der Ruhr  

  1004. High Voltage RF-Multiplexer for medical Applications – Development of a Test Environment up to 100 V and 100 MHz   Bjoern Bieske, Dagmar Kirsten tm - Technisches Messen, 85(5), pp. 302-311, DOI: https://doi.org/10.1515/teme-2017-0117  

  1005. High-bandwidth (BiCMOS, OEIC) for optical storage systems   M. Heise, IEEE Internt. Solid-State Circuits Conference (page 384-385), San Francisco, CA, 15-17 Feb. 1999  

  1006. High-Frequency Performance of GaN High-Electron Mobility Transistors on 3C-SiC/Si Substrates With Au-Free Ohmic Contacts   Wael Jatal, Uwe Baumann Katja Tonisch Frank Schwierz Jörg Pezoldt Electron Device Letters, IEEE, Volume:36, Issue: 2, Page(s) 123-125, DOI: http://dx.doi.org/10.1109/LED.2014.2379664  

  1007. High-level Modeling für analoge Module mit SystemC   E. Ulicna, In: 7.Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, S. 36-39. Technische Universität Chemnitz, 2005  

  1008. High-level Modeling für analoge Module mit SystemC   E. Ulicna, 26.10.2005, 7.Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz  

  1009. High-Precision Mixed-Signal Sensor Interface for a Wide Temperature - Range [0°-300°C]   Georg Gläser, Dirk M. Nuernbergk Dagmar Kirsten André Richter Marco Reinhard Gerrit Kropp International Conference and Exhibition on High Temperature Electronics Network, HiTen 2017, 10-12 July 2017, Queens College, Cambridge, UK  

  1010. High-Precision Mixed-Signal Sensor Interface for a Wide Temperature Range [0° – 300°C]   Georg Gläser, Dagmar Kirsten André Richter Marco Reinhard Gerrit Kropp Dirk M. Nuernbergk Journal of Microelectronics and Electronic Packaging, January 2018, Vol. 15, No. 1, pp. 1-8, DOI: https://doi.org/10.4071/imaps.523847