Aktuelle Publikation
Parametric Measurement Unit and Pin Electronics for modular Mixed Signal Test Systems
A. Rolapp1.
R. Paris1.
Chip, Packaging, Design, Simulation and Test - International Conference, Workshop and Table-top Exhibition 'Semiconductor Conference Dresden 2009' (SCD 2009), 29. - 30. April 2009, Dresden
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ilmenau.
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