The developed test system can rapidly inspect about 10,000 structures on such wafers. Photograph: IMMS.
The developed test system can rapidly inspect about 10,000 structures on such wafers. Photograph: IMMS.

SMARTIEHS

SMART InspEction system for High Speed and multifunctional testing of MEMS and MOEMS

The newly developed measurement system can simultaneously inspect MEMS structures on wafer level to significantly reduce test effort.

In the semiconductor industry the trend towards larger wafer diameters and smaller elements leads to a higher number of units that have to be tested per wafer. In addition, the rising quality standards demand a 100% test of all elements. All these requirements cannot be efficiently met with the currently applied test methods, since by now single elements are sequentially measured. On 8-inch wafers, for example, an average of 10,000 structures is placed. In order to test these structures faster, a scalable parallel measurement system was developed in the project. It is able to simultaneously test 25 MEMS structures on wafer level. An extension to up to 100 test units is possible.

IMMS was leading the implementation of the whole inspection system and the test methods. The system platform constructed at the institute united all developed mechanical and optical assemblies of all project partners in a full working demonstrator.

Furthermore, IMMS developed hardware and software components to process the data of the smart pixel cameras of the test system and created precise drive and control solutions of the scanning unit.

  • Funding

    The project was funded by the European Union via the FP7-ICT-2007-2 program, grant number 223935 GA.

Duration

2008 – 2011

Reference

GA 223935