Tests for an ASIC developed by IMMS for extremely precise measurements in very hot environments. Photograph: IMMS.
Tests for an ASIC developed by IMMS for extremely precise measurements in very hot environments. Photograph: IMMS.


Development, test and characterisation of a high-temperature ASIC for pressure sensor structures for an extended temperature range to 300°C

Integrated sensors and microelectronics are being developed to operate at 300°C and to enable more efficient processes.

In the HoTSens project, integrated sensors and electronics have been developed as a system solution, which will measure pressure and temperature with deviation of less than 2% either way when the ambient temperature is as high as 300°C.

This is sensor technology which is vital in industrial situations where data must be captured despite extraordinarily high ambient temperatures.

No specialised ASICs (application-specific integrated circuits) have so far been available for use at operating temperatures above 225°C. To enable today’s increasingly complex machinery and equipment to be operated safely with the highest possible efficiency in use of resources and energy, the state of each device and process needs to be monitored at many points simultaneously, fast and accurately. The nearer to the process is any sensor and signal-evaluating equipment, the less interference there will be, and the more exactly can the signals be registered and processed. However, bringing such a system closer to the process means that it will need to withstand ever higher temperatures.

The new module has high-temperature electronics integrated into it. The resulting sensor system will amplify and calibrate the primary signals from a combined pressure and temperature sensor in such a way that any potential errors in the pressure signal are ironed out.

IMMS has developed high-temperature ASICs with time-coded signals and adjustment algorithms for precise measurements and has tested and characterised them. For the purpose, a new test setup was first designed and made, then successfully tested. It has an integrated cooling system to enable full semi-automatic wafer testing up to 300°C. Second, a high-precision substitute bridge circuit has been designed, then constructed and successfully used for the characterisation.

  • Funding

    The HoTSens project is funded by the German Federal Ministry of Education and Research in the IKT 2020 programme under the reference 16ES0008.


2013 – 2016