Presentation of research results at the ESSCIRC2014 conference in Venice. Photograph: IMMS.
Presentation of research results at the ESSCIRC2014 conference in Venice. Photograph: IMMS.

Reviewed scientific article 2019

Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration

M. Fischer1. S. Gropp1. J. Stegner1. A. Frank2. M. Hoffmann1. J. Mueller1.

in IEEE Microwave Magazine, vol. 20, no. 10, pp. 28-43, Oct. 2019. DOI: doi.org/10.1109/MMM.2019.2928675.

1IMN MacroNano, Technische Universität Ilmenau, Germany. 2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.

Enhancing RF Bulk Acoustic Wave Devices: Multiphysical Modeling and Performance

V. Chauhan1. C. Huck2. A. Frank3. W. Akstaller1. R. Weigel1. A. Hagelauer1.

in IEEE Microwave Magazine, vol. 20, no. 10, pp. 56-70, Oct. 2019. DOI: doi.org/10.1109/MMM.2019.2928677.

1Institute for Electronics Engineering, University of Erlangen-Nuremberg, Germany. 2Institute of Physics, University of Augsburg, Germany. 3IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.

A Fully Passive RFID Temperature Sensor SoC With An Accuracy Of ±0.4 °C (3σ) From 0 °C To 125 °C

Jun Tan1. Muralikrishna Sathyamurthy1. Alexander Rolapp1. Jonathan Gamez1. Eckhard Hennig2. Eric Schäfer1. Ralf Sommer1.

in IEEE Journal of Radio Frequency Identification, vol. 3, no. 1, pp. 35-45, March 2019. DOI: doi.org/10.1109/JRFID.2019.2896145.

1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany. 2Reutlingen University, Reutlingen, Germany.