Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration
Michael Fischer1. Sebastian Gropp1. Johannes Stegner1. Astrid Frank2. Martin Hoffmann1. Jens Mueller1.
in IEEE Microwave Magazine, vol. 20, no. 10, pp. 28-43, Oct. 2019. DOI: doi.org/10.1109/MMM.2019.2928675.
1IMN MacroNano, Technische Universität Ilmenau, Germany. 2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.