For ASIC developments we involve our design and test engineers as well as manufacturing partners from the very beginning. Photograph: IMMS.
For ASIC developments we involve our design and test engineers as well as manufacturing partners from the very beginning. Photograph: IMMS.

ASIC development

We offer the design and realisation of application-specific integrated circuits (ASICs) in CMOS, BiCMOS and SOI technologies. Many years of experience and profound ASIC development know-how are our foundation to find the best solutions for your application. Together with you we acquire a development concept leading to the perfected compromise between performance, operating conditions and manufacturing costs. Our team of specialists for

  • analog and digital circuits,
  • radio frequency technology and
  • opto electronics

balances the limitations of accuracy and bandwidth, power consumption, chip size and the choice of technology as an example. Such a concept is then implemented according to our qualified ASIC design flow. Thanks to a close collaboration between our design and test engineers as well as with our manufacturing partners, we achieve well-performing ASICs with our first runs (first-time right silicon).

Our design flow incorporates the following phases, which we also offer as partial services:

  • Feasibility and concept study,
  • development of specification,
  • development of a virtual prototype,
  • circuit design,
  • physical implementation,
  • wafer manufacturing,
  • characterization and test,,
  • qualification and transfer to production.

We document all phases intensively and organize regular project reviews with our customers. We employ certified partners for all process steps that we cannot operate in-house, e.g. manufacturing and dicing of wafers, or wire bonding and packaging of the ASICs.

  • Our portfolio includes the design and realisation of:

    • Precision amplifiers,
    • radio-frequency (RF) circuit upto 5 GHz,
    • high-voltage (HV) circuits upto 200 V,
    • high-temperature (HT) circuits upto 300 °C,
    • control loops,
    • clocked circuits,
    • integrated optical receivers,
    • integrated sensors,
    • digital interfaces,
    • complex sequence controllers,
    • embedded microcontrollers,
    • firmware and driver software.
  • We could rely on many proven basic components:

    • Operational and instrumentation amplifiers (op-amp),
    • transimpedance amplfiers (TIA) and charge-sensitive amplifiers (CSA),
    • low-noise and power amplifiers (LNA, PA), mixers and filters,
    • current and voltage regulators (LDO) and converters (DCDC),
    • delta-sigma modulators (DSM) and phase-locked loops (PLL),
    • bandgap, power-on-reset- (POR) and delay circuits,
    • integrated photodiodes as well as temperature and pH sensors,
    • self-test and calibration circuits (BIST),
    • A/D converters (ADC) and D/A converters (DAC),
    • communication interfaces (SPI, I2C, PWM, SENT, DALI),
    • actor and bus drivers
    • and other components.
  • We chose the appropriate design methodology

    Being a Lead Institution for Analog Mixed-Signal Design Methodology in the Cadence Academic Network we are familiar with the newest design methods and tools. For the implementation of a mixed-signal ASIC for instance, we use classical techniques based on Verilog-AMS as well as modern approached for modelling and synthesis based on high abstraction levels with SystemC. Depending on the application, we always evaluate individually of your objectives are achievable with established or innovation practices.

  • We use the following design tools:

    • Cadence Virtuoso Custom IC
    • Cadence Incisive Fuctional Verification
    • Cadence Encounter Digital Implementation
    • Coventor MEMS+
    • MathWorks MATLAB/Simulink
    • Synopsys Technology Computer-Aided Design
    • Wolfram Mathematica

    Our specially developed design environment software EDA-TOOLS manages the design data as well as the setup of the design tools and controls the users’ access privileges.