Presentation of research results at the ESSCIRC2014 conference in Venice. Photograph: IMMS.
Presentation of research results at the ESSCIRC2014 conference in Venice. Photograph: IMMS.

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Investigations of metal systems in a silicon ceramic composite substrate for electrical and thermal contacts as well as associated mounting aspects

M. Fischer1. T. Welker1. B. Leistritz2. S. Gropp1. C. Schäffel2. M. Hoffmann1. J. Müller1.

Ceramic Interconnect and Ceramic Microsystems Technologies, Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT): May 2016, Vol. 2016, No. CICMT, pp. 000107-000110, DOI: dx.doi.org/10.4071/2016CICMT-WA22.

1Technische Universität Ilmenau, IMN MacroNano®, Ilmenau, Germany. 2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, D-98693 Ilmenau, Germany.